* УТОЧНЯЙТЕ ВОЗМОЖНОСТЬ, ЦЕНУ И СРОК ПОСТАВКИ, В СВЯЗИ С ОГРАНИЧЕНИЕМ ЭКСПОРТА ТОВАРОВ ИЗ СТРАН ЕС И ВЕЛИКОБРИТАНИИ
Hirose original 1.27mm pitch High-Density I/O connectors
1.27mm contact spacing conserves valuable board space and permits ultra-high density designs
Bellow contacts create smooth and precise mating and unmating
Unique shell design assures first make/mast break grounding and overall noise protection
IDC termination allows quick and low cost termination to AWG #28 and #30 wires
Back Shell and receptacle shell are made of diecast zinc alloy to reduce the penetration of external EMI noise
Easy to use 'One-Touch' and 'Screw' locking mechanisms assure quick and easy 'positive' closures every time
Termination method is available in IDC, Soldering, Right Angle Dip, Straight Dip and SMT
DX with 3 cavities and 2 cavities for Co-axial contacts are newly introduced to meet the needs of high speed data transmission
Shielded Plug-in type for interface between 2 Units available
This product is a cover case for high-density I/O connectors.
Техническая спецификацияDatasheet
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