* УТОЧНЯЙТЕ ВОЗМОЖНОСТЬ, ЦЕНУ И СРОК ПОСТАВКИ, В СВЯЗИ С ОГРАНИЧЕНИЕМ ЭКСПОРТА ТОВАРОВ ИЗ СТРАН ЕС И ВЕЛИКОБРИТАНИИ
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
packages: 1515size: 3.8mm x 3.8mm x 0.9mmview angle: 120°substrate: AlN Ceramicfor High Power applicationstechnology: InGaNsoldering pads: silver platedsuitable for all SMT assembly methods
size: 3.2mm x 1.6mm x 1.2mmcircuit substrate: AIN Ceramics Lead free solderable, soldering pads:silvertaped in 12 mm blister tape, cathode to transporting perforationall devices sorted into luminous intensity classestaping: face-up(TU) or face-down(TD) possible
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