43031-0007, Molex MICRO-FIT 3.0 43031 Crimp Terminal Contact, Male, 0.2mm² to 0.5mm², 24AWG to 20AWG, Tin Plating, Контакты

Molex Micro-Fit 3.0 mm Crimp Contacts

Pin and receptacle crimp contacts for use in the Micro-Fit 3.0 mm plug and receptacle housings. These crimp pin and receptacle terminals feature multiple points of contact for a reliable electrical connection and a higher current carrying capacity. Locking tangs on the crimp contacts secure them firmly in the connector housing. The 46235 series crimp contacts are RMF (Reduced Mating Force) contacts which have a reduced engagement and disengagement force for ease of use. These Micro-Fit crimp contacts are available with a range of platings and wire size ranges for design flexibility

Features and Benefits

• Multiple points of contact for reliable electrical connection
• Locking tangs for secure connection in housing
• Reduce Mating Force versions for ease of use
• Range of platings and wire sizes for design flexibility

Molex Micro-Fit 3.0 Male Crimp Contact, 24 to 20AWG - 43031 Series - 43031-0007

For a strong and secure electrical connection to a PCB (printed circuit board) or terminal wire, pick this male crimp contact from Molex. It's ideal for use where space is limited and is designed to slide right into Micro-Fit 3.0mm plug and receptacle housings. Locking tangs secure the contacts to the housing to prevent vibration and loosening. The receptacle terminals include multiple points of contact to create a highly reliable join, allowing for higher current-carrying capacity and greater efficiency.

• Built from phosphor bronze and plated with tin to provide better conductivity and resistance to corrosion
• Wide operating temperature of -40°C to +105°C for a variety of harsh industrial environments
• Low halogen content limits risk of toxic fumes should a fire or excessive heating occur

Applications

• Automotive industry
• Medical equipment
• Communications equipment

Will the connection corrode over time?

Connections made with a crimp contact are airtight, so moisture and debris can't get in and corrode the wires. In addition, because no alloy filler is used to create the join, the bond is mechanically stronger and will last longer than a soldered connection.

Molex Micro-Fit 3.0 Series

Datasheet

Datasheet

Drawing - 43031-0007