* УТОЧНЯЙТЕ ВОЗМОЖНОСТЬ, ЦЕНУ И СРОК ПОСТАВКИ, В СВЯЗИ С ОГРАНИЧЕНИЕМ ЭКСПОРТА ТОВАРОВ ИЗ СТРАН ЕС И ВЕЛИКОБРИТАНИИ
The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.
High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
Datasheet - 77313-101-72LF