453-00085-K1, Laird Connectivity Chip Antenna, Development Kit, Sterling-LWB+ Chip Antennas. Bluetooth, W-LAN Development Kit for

The Laird Connectivity Sterling LWB+ communication & wireless development tool is a high performance 2.4 GHz WLAN and Bluetooth combo module based on latest-generation silicon with an industrial temperature rating, broad country certifications and the availability of three different package styles the sterling LWB+ provides significant flexibility to meet various end user application needs. The sterling LWB+ is the successor of Laird connectivity sterling LWB product series two SMT type modules are even pin-to-pin and drop replacement to the platform using Sterling LWB the on-module chip antenna package style for the sterling LWB+ eliminates complexity for design integration simplifies manufacturing assembly with larger pin outs and features an advanced chip antenna that offers greater resistance to de-tuning than typical trace or chip antennas.

Available in two footprint styles SMT module 15.5 mm x 21 mm
SiP 12 mm x 12 mm
Available with antenna trace pin, integrated chip antenna or MHF 4 connector for external antenna
Operating voltage VBAT 3.2V to 4.8V (3.6V typical)
Operating temperature -40o to +85o C
Operating humidity less than 85% R.H.
Storage temperature -40° to +125°C
Storage humidity Less than 60% R.H Compact design based on Infineon CYW4349_A1 SoC
Worldwide acceptance FCC, ISED (Canada), EU, MIC (Japan), and AS/NZS ▪ BT SIG QDID 100864

Datasheet - 453-00085-K1