* УТОЧНЯЙТЕ ВОЗМОЖНОСТЬ, ЦЕНУ И СРОК ПОСТАВКИ, В СВЯЗИ С ОГРАНИЧЕНИЕМ ЭКСПОРТА ТОВАРОВ ИЗ СТРАН ЕС И ВЕЛИКОБРИТАНИИ
The OKdo ROCK 3 Compute Module SODIMM (CM3S) Model A is a highly impressive device that offers an array of features within its compact design. It’s based on the Rockchip RK3566 System on Chip (SoC), which boasts a robust CPU, a Power Management Unit (PMU), DRAM memory. All these components are packed into a compact DDR2 SODIMM form factor, measuring just 67.6mm x 32mm.
The CM3S is a cost-effective, and highly versatile solution for a wide range of applications. Despite its small size, this device is a true powerhouse. This variant offers 1GB of LPDDR4 RAM.
The CM3S accelerates product development by providing a powerful SoM in a compact form factor. With a simple carrier board (a 2-layer baseboard is sufficient to provide access to all functions of the SoM), engineers can rapidly develop solutions and prepare the boards for production.
Please note: The images above show a CM3S-specific model. This model has certain features like wireless communication capabilities or eMMC. Depending on the purchased SKU there might be variations to the populated components.
Hardware
CPU: Quad‑core Arm® Cortex®‑A55 (ARMv8) 64‑bit @ 1.6GHz
GPU: Arm Mali™‑G52‑2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1
NPU: 0.8 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc
Memory: 32bit LPDDR4X 1GB
Display: Single display engine, HDMI2.0, Dual MIPI‑DSI
Multi‑Media: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder
Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI‑2 and DVP interface
Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels
High-Speed Interface: One SATA 3.0/PCIe 2.1 combo port, and one USB 2.0 OTG
Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to de-bug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)
Interfaces
up to 5 x I2C
up to 3 x SPI
up to 8 x UART
up to 12 x PWM
up to 60x GPIO
1 x ADC
2 x I2S
1 x PCIe 2.0, 1 lane host (5Gbps)
1 x SATA 3.0(shared with PCIe)
1 x USB 2.0 OTG
1 x SDIO 3.0
1 x HDMI up to 4K x 2k@60Hz
2 x 2 lane or 1 x 4 lane MIPI CSI camera port
1 x MIPI DSI 2 lane @ 1.6Gbps per lane
1 x MIPI DSI 4 lane @ 1.6Gbps per lane
3.3V ∼ 5V power input
260 pins SODIMM golden finger edge connector
Let's work together
OKdo has manufacturing capabilities and technical engineering consultants to support long-term stock availability and design longevity. If you would like to collaborate on your next project, let’s design the future together: contact sales@okdo.com
Техническая спецификацияDatasheet RM117-D1E0W0
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