SEAM-40-03.5-S-08-2-A-K-TR, Samtec SEAM Series Straight Surface Mount PCB Header, 320 Contact(s), 1.27mm Pitch, Shrouded

1.27mm SEARAY™ Series Interconnects

SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.

Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area

SEARAY™ High Speed, High Density Arrays Literature

SEAM Series High Speed/High Density Open Pin Field Customer Drawing

SEAM Series High Speed/High Density Open Pin Field Footprint Drawing

SEAM Series High Speed/High Density Open Pin Field Catalogue Page